Opportunity Information: Apply for 22 636
Advanced Chip Engineering Design and Fabrication (ACED Fab) is a joint U.S.-Taiwan research funding opportunity run by the National Science Foundation (NSF) and Taiwan's National Science and Technology Council (NSTC). The program is designed to bring together complementary strengths in semiconductor research from both countries, with the practical goal of moving beyond theory into real chip prototypes. In other words, it is not just about new ideas in circuits or devices, but about proving those ideas in fabricated integrated circuits that demonstrate advanced functionality, with fabrication capability serving as a key differentiator.
The collaboration is structured under a formal government-to-government framework: a Memorandum of Understanding (MOU) and an implementing arrangement related to advanced semiconductor chip design and fabrication, signed by the American Institute in Taiwan (AIT) and the Taipei Economic and Cultural Representative Office in the United States (TECRO). Under this arrangement, U.S. researchers are funded by NSF and Taiwan researchers are funded by NSTC, but the project is treated as one integrated international effort rather than two separate grants stitched together after the fact.
A central feature of ACED Fab is its "lead agency" model. A U.S.-Taiwan team submits a single joint proposal, and NSF serves as the lead agency that manages one unified merit review process. NSTC agrees to honor the NSF review outcomes and coordinates with NSF on final award decisions. If selected, funding is issued in parallel: NSF makes awards to the U.S. side while NSTC makes corresponding awards to the Taiwan side, aligned in timing and project duration so the team can execute as a coordinated unit.
Technically, the program is focused on innovative chip design and fabrication projects that make use of advanced fabrication technologies available through Taiwan's semiconductor foundries. Proposals are expected to be tightly tied to actual manufacturing access, specifically requiring at least one chip design to reach tape-out and be fabricated through Taiwan foundries using multi-project wafer (MPW) runs within the project period. This requirement makes ACED Fab especially oriented toward deliverables like prototype ICs, measured silicon results, and demonstrations that validate new approaches under real process constraints.
The solicitation encourages projects aimed at emerging and strategically important applications. Examples called out include high-performance and low-power circuits and systems, edge AI for sensing/computing/communications, quantum computing and communication chips, and new forms of heterogeneous integration in semiconductors. The language leaves room for additional topics beyond this list, but the consistent theme is that proposals should push capabilities forward in a way that benefits semiconductor science, engineering, and education, while making concrete use of Taiwan's advanced fabrication ecosystem.
Administratively, the opportunity is listed as an NSF discretionary grant program in the science and technology research and development category (CFDA 47.041 and 47.079). The opportunity number is 22-636, with an original closing date of January 17, 2023, and an expected number of awards noted as seven. The notice does not specify an NSF award ceiling in the summary fields provided, and funding limits for the Taiwan side are referenced as being available through NSTC's corresponding announcement. For questions about the program, NSF directs inquiries to nsf-acedfab@nsf.gov, and Taiwan participants are pointed to NSTC's announcement webpage for participation details and budget constraints.Apply for 22 636
- The National Science Foundation in the science and technology and other research and development sector is offering a public funding opportunity titled "Advanced Chip Engineering Design and Fabrication" and is now available to receive applicants.
- Interested and eligible applicants and submit their applications by referencing the CFDA number(s): 47.041, 47.079.
- This funding opportunity was created on Oct 01, 2022.
- Applicants must submit their applications by Jan 17, 2023. (Agency may still review applications by suitable applicants for the remaining/unused allocated funding in 2026.)
- The number of recipients for this funding is limited to 7 candidate(s).
- Eligible applicants include: Others (see text field entitled Additional Information on Eligibility for clarification).
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| Field Initiated Projects Program (Development) Apply for HHS 2023 ACL NIDILRR IFDV 0000 Funding Number: HHS 2023 ACL NIDILRR IFDV 0000 Agency: Department of Health and Human Services, Administration for Community Living Category: Science and Technology and other Research and Development Funding Amount: $200,000 |
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